From: Wayne T. Reiersen
Sent: Tuesday, January 30, 2007 3:12 PM
To: Wayne T. Reiersen; Bradley E. Nelson; 'mjc@ornl.gov'; 'xdw@ornl.gov'; 'Paul Goranson (goransonpl@ornl.gov)'; 'Kevin Freudenberg (freudenbergk@ornl.gov)'; Lawrence E. Dudek; Michael E. Viola; James H. Chrzanowski; Steve Raftopoulos; Thomas G. Brown; Brentley C. Stratton; Arthur W. Brooks; Hutch Neilson; Michael C. Zarnstorff; Ronald L. Strykowsky; Geoffrey J. Gettelfinger; Mike Williams; George W. Labik; Bob Simmons; Raymond C. Gernhardt; Phil Heitzenroeder; Paul Sichta; Bob Simmons; Robert A. Ellis; 'fogartypj@ornl.gov'
Subject: Notes from Monday's telecon

Folks,

The weekly telecon was held with ORNL again this past Monday.  Notes and presentation material are posted at the following URL:

http://ncsx.pppl.gov/NCSX_Engineering/Meetings/CY-2007/January/070129_MondayTelecon/070129_index.htm

G10-on-SS and SS-on-SS both exhibited a low COF (<0.25)

"Light" versus "Standard" nickel binder made no change (COF=0.53)

CTD540 was marginally better than Stycast (COF=0.51 versus 0.46) and easier to use

Larger (12 mil) diamonds marginally better than smaller diamonds (COF=0.56 versus 0.51) but may make dimensional control more difficult

CTD540 appeared marginally better than the nickel binder (COF=0.56 versus 0.53 with 12 mil diamonds).  The diamond coated surface appeared unchanged in the post-mortem for the nickel binder.  The diamond particles appeared loose in the post-mortem for the CTD540 binder.  The relative permeability in the nickel binder was 1.7-1.9.

Depositing the diamond coating on a 4mil grit blasted sheet of SS with a nickel binder provided marginally better performance (0.55 versus 0.53) than the same coating applied to the thicker bar.

Future screening tests with focus on using CTD540 (no permeability issues) and smaller (6mil) diamonds (easier for dimensional control).  The configuration issue of using a separate high COF SS gasket or depositing the high COF material directly on the shim needs to be addressed.  The shear strength of a glass-epoxy joint will also be addressed in the next round of testing.

The next telecon will be next Monday at the regular time and place.

Wayne