From: Matt Hooker [matt@ctd-materials.com]
Sent: Monday, November 01, 2004 6:40 PM
To: Michael R. Kalish
Cc: Paul Fabian
Subject: Microclean and Chembond processes

Follow Up Flag: Follow up
Flag Status: Red

Mike,

 

Paul and I were discussing the work we are going to do for you and wanted to make sure you were aware of the procedures that are used with the Microclean and Chembond materials.  Both systems are designed for use with immersion tank processes.  For Microclean, the copper is immersed for 1-2 minutes at 50-70C and then rinsed with water.  For Chembond, the copper is immersed for 3 minutes at 40C and rinsed with water.  These are the procedures recommended by the manufacturer (RD Chemical).  These materials could also be sprayed on and then rinsed off to treat the copper surface, although the vendor doesn’t have much experience with that technique.  They primarily sell into the circuit board industry where tank processes are used.

 

For your specimens, the surface of the copper that will contact the composite will be dipped into a solution maintained at the appropriate temperature.  My plan is to clean 4 sets of copper surfaces tomorrow (Tuesday 11/2) and allow them to rest in ambient air for one week.  The remaining copper surfaces will be treated next Tuesday (11/9), followed immediately by the production of the 16 composite specimens.

 

Please feel free to contact me as shown below if you have any questions about the Microclean and/or Chembond processes and I will be glad to discuss them with you.

 

Matt 

 

Matthew Hooker, Ph.D., Senior Engineer

Composite Technology Development, Inc.

2600 Campus Drive, Suite D

Lafayette, CO 80026

Ph: (303) 664-0394, ext. 137

Fax: (303) 664-0392

e-mail: matt@ctd-materials.com